Dietmar Flügel: Digital technologies such as artificial intelligence and intelligent packaging in particular have long since found their way into the packaging industry and are becoming increasingly relevant with regard to the switch to resource-saving production processes and the development of sustainable packaging solutions.
For example, AI is already able to optimise packaging processes through precise predictions of material requirements, the selection of sustainable materials, real-time monitoring of supply chains and the adaptation of production processes. Bottlenecks can be recognised autonomously, quality control can be improved and energy-efficient operating modes can be used to conserve resources and reduce costs. In addition, AI supports packaging design through trend analyses, personalised designs and automated layout creation. It also helps with colour selection and creates realistic 3D models. In terms of sustainability, AI contributes to the development of environmentally friendly materials, the evaluation of recyclability and the optimisation of packaging sizes in the context of waste avoidance.
Another development that reflects the increasing relevance of digitalisation within the packaging industry is the cross-sector introduction of the Digital Product Passport (DPP) by the European Union by 2030. The DPP contains important information on the origin, materials, recyclability and environmental impact of a product. In the packaging sector, the DPP helps to improve traceability and promote the recyclability of packaging. This enables manufacturers and consumers to make informed and resource-saving decisions and transparently understand the life cycle of a product.
This is accompanied by the introduction of intelligent packaging functions, known as smart packaging, which are becoming increasingly popular. In particular, functions and sensors for measuring and regulating temperature fluctuations, light incidence and humidity, among other things, are appreciated by retailers and consumers.
Please also read part 1.